1. General characteristics
The solder was produced in the first smelt of tin and copper. The use of a continuous casting process ensures minimization of the generation of oxides in the solder. As a result, the phenomenon of the formation of dross in the soldering process is significantly reduced. The composition of the solder complies with the ISO 9453:2014 standard. The solder alloy intended for mechanized soldering in electronics, electrical engineering and other industrial applications where meeting the requirements of the RoHS2 Directive is required.
2. Alloy composition [%]
|
Sn
|
Cu
|
Bi
|
Sb
|
Ag
|
Cd
|
Au
|
In
|
Pb
|
Al
|
As
|
Fe
|
Ni
|
Zn
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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rest
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0,50 - 0,90
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max 0,10
|
max 0,10
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max 0,10
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max 0,002
|
max 0,05
|
max 0,1
|
max 0,07
|
max 0,001
|
max 0,03
|
max 0,02
|
max 0,01
|
max 0,001
|
3. Physical and chemical properties
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Melting point: (solidus / liquidus)
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227°C
|
|
Density
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7,31 g/cm3
|
|
Electrical conductivity
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0,126 μΩ•m
|
|
Thermal conductivity
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66 W/m•K
|
|
Tensile strength
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300 kgf/cm2
|
|
Elongation at break
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21%
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Hardness
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9 HB
|
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Recommended soldering tip temperature
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250 - 400°C
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4. Other information
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Available diameters
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• 0,50 • 0,80 • 1,00 • 1,20 • 1,50 • 2,00 • 3,00 mm other on request
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Available cross-sections and sizes
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On request
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Expiration date
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not applicable
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Label
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The product is marked by a type of alloy or acc. to customer requirements Cartons, reels marked with a type of alloy, sizes, lot number and net weight.
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Storage
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Keep away from strong oxidizing agents, acids and alkaline agents. The recommended humidity level is 20-60% and temperature is 5 – 20 °C
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Files to download:
Physical, mechanical and chemical properties available in the TDS data sheet (download above).
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