1. General characteristics
Lead-free paste based on Sn96.5Ag3Cu0.5 (SAC305) alloy, no-clean type with halogen-free flux. The product is intended for professional soldering in surface mount technology where compliance with the RoHS2 directive is required.
2. Alloy composition [%]
|
Sn
|
Ag
|
Cu
|
Bi
|
Cd
|
Sb
|
Au
|
In
|
Pb
|
Al
|
As
|
Fe
|
In
|
Zn
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
96 do 97
|
2,8 do 3,2
|
0,3 do 0,7
|
max 0,1
|
max 0,002
|
max 0,1
|
max 0,05
|
max 0,1
|
max 0,07
|
max 0,001
|
max 0,03
|
max 0,02
|
max 0,01
|
max 0,001
|
3. Physical and chemical properties
|
Melting temperature
|
solid 217 / liquid 220°C
|
|
Specific gravity
|
7.38 g/ cm3
|
|
Resistivity
|
0,132 μΩ•m
|
|
Thermal conductivity
|
58 W/m•K
|
|
Tensile strength at break
|
500 kg/cm2
|
|
Elongation at break
|
19%
|
|
Hardness
|
15 HB
|
|
Recommended soldering tip temperature
|
250 - 350°C
|
4. Paste properties
|
Grain size
|
T3, T3L, T4
|
|
Metal content
|
88 do 90%
|
|
Gunner type
|
RO L0
|
|
Halogen content
|
0,00%
|
|
Copper mirror test
|
OK
|
5. Other information
|
Packaging available
|
500 g jars Others to be agreed
|
|
Expiration date
|
8 months from the date of production
|
|
Storage
|
Store the paste in a tightly closed original container at a temperature of 3°C - 7°C
|
Files to download:
Physical, mechanical and chemical properties available in the TDS data sheet (download above).
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